IEC - International Electrotechnical Commission - IEC 60191-4:2013/AMD1:2018

Amendment 1 - Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages

published
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Organization: IEC - International Electrotechnical Commission
Publication Date: 27 March 2018
Status: published
Page Count: 29
ICS Code (Semiconductor devices in general): 31.080.01

Document History

Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
IEC 60191-4:2013+A1:2018 specifies a method for the designation of package outlines and for the classification of forms of package outlines for semiconductor devices and a systematic method for...
IEC 60191-4:2013/AMD1:2018
March 27, 2018
Amendment 1 - Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
A description is not available for this item.
October 10, 2013
Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
IEC 60191-4:2013 specifies a method for the designation of package outlines and for the classification of forms of package outlines for semiconductor devices and a systematic method for generating...
Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
Describes a method for the designation and the classification into forms of package outlines for semiconductor devices. Provides a systematic method for generating universal descriptive designators...
Amendment 2 - Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
A description is not available for this item.
November 27, 2001
Amendment 1 - Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
A description is not available for this item.
October 8, 1999
Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
Describes a method for the designation and the classification into forms of package outlines for semiconductor devices. Provides a systematic method for generating universal descriptive designators...
March 30, 1987
Mechanical standardization of semiconductor devices. Part 4: Coding systems and classification into forms of package outlines for semiconductor devices
Gives recommended practice for the designation of package outlines and for the classification into forms of package outlines for semiconductor devices.
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