IEC - International Electrotechnical Commission - IEC 60191-4:2013
Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
published
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| Organization: | IEC - International Electrotechnical Commission |
| Publication Date: | 10 October 2013 |
| Status: | published |
| Page Count: | 48 |
| ICS Code (Semiconductor devices in general): | 31.080.01 |
abstract:
IEC 60191-4:2013 specifies a method for the designation of package outlines and for the classification of forms of package outlines for semiconductor devices and a systematic method for generating... View More
Document History
March 27, 2018
Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
IEC 60191-4:2013+A1:2018 specifies a method for the designation of package outlines and for the classification of forms of package outlines for semiconductor devices and a systematic method for...
March 27, 2018
Amendment 1 - Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
A description is not available for this item.
IEC 60191-4:2013
October 10, 2013
Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
IEC 60191-4:2013 specifies a method for the designation of package outlines and for the classification of forms of package outlines for semiconductor devices and a systematic method for generating...
October 22, 2002
Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
Describes a method for the designation and the classification into forms of package outlines for semiconductor devices. Provides a systematic method for generating universal descriptive designators...
July 17, 2002
Amendment 2 - Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
A description is not available for this item.
November 27, 2001
Amendment 1 - Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
A description is not available for this item.
October 8, 1999
Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
Describes a method for the designation and the classification into forms of package outlines for semiconductor devices. Provides a systematic method for generating universal descriptive designators...
March 30, 1987
Mechanical standardization of semiconductor devices. Part 4: Coding systems and classification into forms of package outlines for semiconductor devices
Gives recommended practice for the designation of package outlines and for the classification into forms of package outlines for semiconductor devices.