IEC - International Electrotechnical Commission - IEC 60191-4:2013+AMD1:2018 CSV
Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
|Organization:||IEC - International Electrotechnical Commission|
|Publication Date:||27 March 2018|
|ICS Code (Semiconductor devices in general):||31.080.01|
a) Material code "S" is added to indicate a silicon based package.
b) Description of "WL" is added to be used for general use. This consolidated version consists of the third edition (2013) and its amendment 1 (2018). Therefore, no need to order amendment in addition to this publication.