IEC - International Electrotechnical Commission - IEC 61189-2:2006
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures
published
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| Organization: | IEC - International Electrotechnical Commission |
| Publication Date: | 30 May 2006 |
| Status: | published |
| Page Count: | 122 |
| ICS Code (Printed circuits and boards): | 31.180 |
abstract:
Provides a catalogue of test methods representing methodologies and procedures that can be applied to test materials used for manufacturing interconnection structures (printed boards) and... View More
Document History
IEC 61189-2:2006
May 30, 2006
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures
Provides a catalogue of test methods representing methodologies and procedures that can be applied to test materials used for manufacturing interconnection structures (printed boards) and assemblies.
January 21, 2000
Amendment 1 - Test methods for electrical materials, interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures
A description is not available for this item.
June 18, 1997
Corrigendum 1 - Test methods for electrical materials, interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures
A description is not available for this item.
April 10, 1997
Test methods for electrical materials, interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures
Provides a catalogue of test methods representing methodologies and procedures that can be applied to test materials used for manufacturing interconnection structures (printed boards) and assemblies....