IEC - International Electrotechnical Commission - IEC 61189-2:1997
Test methods for electrical materials, interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures
revised
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| Organization: | IEC - International Electrotechnical Commission |
| Publication Date: | 10 April 1997 |
| Status: | revised |
| Page Count: | 139 |
| ICS Code (Printed circuits and boards): | 31.180 |
abstract:
Provides a catalogue of test methods representing methodologies and procedures that can be applied to test materials used for manufacturing interconnection structures (printed boards) and... View More
Document History
May 30, 2006
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures
Provides a catalogue of test methods representing methodologies and procedures that can be applied to test materials used for manufacturing interconnection structures (printed boards) and assemblies.
January 21, 2000
Amendment 1 - Test methods for electrical materials, interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures
A description is not available for this item.
June 18, 1997
Corrigendum 1 - Test methods for electrical materials, interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures
A description is not available for this item.
IEC 61189-2:1997
April 10, 1997
Test methods for electrical materials, interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures
Provides a catalogue of test methods representing methodologies and procedures that can be applied to test materials used for manufacturing interconnection structures (printed boards) and assemblies....