IEC - International Electrotechnical Commission - IEC 61189-2:1997/AMD1:2000

Amendment 1 - Test methods for electrical materials, interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures

revised
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Organization: IEC - International Electrotechnical Commission
Publication Date: 21 January 2000
Status: revised
Page Count: 37
ICS Code (Printed circuits and boards): 31.180

Document History

May 30, 2006
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures
Provides a catalogue of test methods representing methodologies and procedures that can be applied to test materials used for manufacturing interconnection structures (printed boards) and assemblies.
IEC 61189-2:1997/AMD1:2000
January 21, 2000
Amendment 1 - Test methods for electrical materials, interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures
A description is not available for this item.
Corrigendum 1 - Test methods for electrical materials, interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures
A description is not available for this item.
April 10, 1997
Test methods for electrical materials, interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures
Provides a catalogue of test methods representing methodologies and procedures that can be applied to test materials used for manufacturing interconnection structures (printed boards) and assemblies....
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