IEC - International Electrotechnical Commission - IEC 60249-2-11:1987/AMD4:2000

Amendment 4 - Base materials for printed circuits. Part 2: Specifications. Specification No. 11: Thin epoxide woven glass fabric copper-clad laminated sheet, general purpose grade for use in the fabrication of multilayer printed boards

withdrawn
Buy Now
Organization: IEC - International Electrotechnical Commission
Publication Date: 24 August 2000
Status: withdrawn
Page Count: 11
ICS Code (Printed circuits and boards): 31.180

Document History

IEC 60249-2-11:1987/AMD4:2000
August 24, 2000
Amendment 4 - Base materials for printed circuits. Part 2: Specifications. Specification No. 11: Thin epoxide woven glass fabric copper-clad laminated sheet, general purpose grade for use in the fabrication of multilayer printed boards
A description is not available for this item.
Amendment 3 - Base materials for printed circuits. Part 2: Specifications. Specification No. 11: Thin epoxide woven glass fabric copper-clad laminated sheet, general purpose grade for use in the fabrication of multilayer printed boards
A description is not available for this item.
Amendment 2 - Base materials for printed circuits. Part 2: Specifications. Specification No. 11: Thin epoxide woven glass fabric copper-clad laminated sheet, general purpose grade for use in the fabrication of multilayer printed boards
Contains Amendment No. 1.
May 15, 1987
Base materials for printed circuits. Part 2: Specifications. Specification No. 11: Thin epoxide woven glass fabric copper-clad laminated sheet, general purpose grade for use in the fabrication of multilayer printed boards
Gives requirements for properties of thin epoxide woven glass fabric copper-clad laminated sheet, general purpose grade, for use in the fabrication of multilayer printed boards. Laminated sheets...
Advertisement