IEC - International Electrotechnical Commission - IEC 60249-2-11:1987/AMD2:1993
Amendment 2 - Base materials for printed circuits. Part 2: Specifications. Specification No. 11: Thin epoxide woven glass fabric copper-clad laminated sheet, general purpose grade for use in the fabrication of multilayer printed boards
withdrawn
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| Organization: | IEC - International Electrotechnical Commission |
| Publication Date: | 18 May 1993 |
| Status: | withdrawn |
| Page Count: | 9 |
| ICS Code (Printed circuits and boards): | 31.180 |
abstract:
Contains Amendment No. 1.
Document History
August 24, 2000
Amendment 4 - Base materials for printed circuits. Part 2: Specifications. Specification No. 11: Thin epoxide woven glass fabric copper-clad laminated sheet, general purpose grade for use in the fabrication of multilayer printed boards
A description is not available for this item.
May 19, 1994
Amendment 3 - Base materials for printed circuits. Part 2: Specifications. Specification No. 11: Thin epoxide woven glass fabric copper-clad laminated sheet, general purpose grade for use in the fabrication of multilayer printed boards
A description is not available for this item.
IEC 60249-2-11:1987/AMD2:1993
May 18, 1993
Amendment 2 - Base materials for printed circuits. Part 2: Specifications. Specification No. 11: Thin epoxide woven glass fabric copper-clad laminated sheet, general purpose grade for use in the fabrication of multilayer printed boards
Contains Amendment No. 1.
May 15, 1987
Base materials for printed circuits. Part 2: Specifications. Specification No. 11: Thin epoxide woven glass fabric copper-clad laminated sheet, general purpose grade for use in the fabrication of multilayer printed boards
Gives requirements for properties of thin epoxide woven glass fabric copper-clad laminated sheet, general purpose grade, for use in the fabrication of multilayer printed boards. Laminated sheets...