IEC - International Electrotechnical Commission - IEC 60249-2-11:1987/AMD3:1994

Amendment 3 - Base materials for printed circuits. Part 2: Specifications. Specification No. 11: Thin epoxide woven glass fabric copper-clad laminated sheet, general purpose grade for use in the fabrication of multilayer printed boards

withdrawn
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Organization: IEC - International Electrotechnical Commission
Publication Date: 19 May 1994
Status: withdrawn
Page Count: 5
ICS Code (Printed circuits and boards): 31.180

Document History

Amendment 4 - Base materials for printed circuits. Part 2: Specifications. Specification No. 11: Thin epoxide woven glass fabric copper-clad laminated sheet, general purpose grade for use in the fabrication of multilayer printed boards
A description is not available for this item.
IEC 60249-2-11:1987/AMD3:1994
May 19, 1994
Amendment 3 - Base materials for printed circuits. Part 2: Specifications. Specification No. 11: Thin epoxide woven glass fabric copper-clad laminated sheet, general purpose grade for use in the fabrication of multilayer printed boards
A description is not available for this item.
Amendment 2 - Base materials for printed circuits. Part 2: Specifications. Specification No. 11: Thin epoxide woven glass fabric copper-clad laminated sheet, general purpose grade for use in the fabrication of multilayer printed boards
Contains Amendment No. 1.
May 15, 1987
Base materials for printed circuits. Part 2: Specifications. Specification No. 11: Thin epoxide woven glass fabric copper-clad laminated sheet, general purpose grade for use in the fabrication of multilayer printed boards
Gives requirements for properties of thin epoxide woven glass fabric copper-clad laminated sheet, general purpose grade, for use in the fabrication of multilayer printed boards. Laminated sheets...
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