IEC - International Electrotechnical Commission - IEC 60191-3:1999
Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits
published
Buy Now
| Organization: | IEC - International Electrotechnical Commission |
| Publication Date: | 29 October 1999 |
| Status: | published |
| Page Count: | 113 |
| ICS Code (Semiconductor devices in general): | 31.080.01 |
| ICS Code (Mechanical engineering drawings): | 01.100.20 |
abstract:
Gives guidance on the preparation of drawings of integrated circuits outlines.
Document History
IEC 60191-3:1999
October 29, 1999
Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits
Gives guidance on the preparation of drawings of integrated circuits outlines.
August 1, 1996
Corrigendum 1 - Amendment 2 - Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits
A description is not available for this item.
November 16, 1995
Amendment 2 - Mechanical standardization of semiconductor devices. Part 3: General rules for the preparation of outline drawings of integrated circuits
A description is not available for this item.
January 1, 1983
Amendment 1 - Mechanical standardization of semiconductor devices. Part 3: General rules for the preparation of outline drawings of integrated circuits
A description is not available for this item.
January 1, 1974
Mechanical standardization of semiconductor devices. Part 3: General rules for the preparation of outline drawings of integrated circuits
Gives general rules to be used for the preparation of outline drawings of integrated circuits and indicates how to number integrated circuit case leads.