IEC - International Electrotechnical Commission - IEC 60191-3:1974/AMD2:1995/COR1:1996

Corrigendum 1 - Amendment 2 - Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits

revised
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Organization: IEC - International Electrotechnical Commission
Publication Date: 1 August 1996
Status: revised
Page Count: 2
ICS Code (Semiconductor devices in general): 31.080.01

Document History

October 29, 1999
Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits
Gives guidance on the preparation of drawings of integrated circuits outlines.
IEC 60191-3:1974/AMD2:1995/COR1:1996
August 1, 1996
Corrigendum 1 - Amendment 2 - Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits
A description is not available for this item.
November 16, 1995
Amendment 2 - Mechanical standardization of semiconductor devices. Part 3: General rules for the preparation of outline drawings of integrated circuits
A description is not available for this item.
January 1, 1983
Amendment 1 - Mechanical standardization of semiconductor devices. Part 3: General rules for the preparation of outline drawings of integrated circuits
A description is not available for this item.
January 1, 1974
Mechanical standardization of semiconductor devices. Part 3: General rules for the preparation of outline drawings of integrated circuits
Gives general rules to be used for the preparation of outline drawings of integrated circuits and indicates how to number integrated circuit case leads.
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