IEC - International Electrotechnical Commission - IEC 60191-3:1974

Mechanical standardization of semiconductor devices. Part 3: General rules for the preparation of outline drawings of integrated circuits

revised
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Organization: IEC - International Electrotechnical Commission
Publication Date: 1 January 1974
Status: revised
Page Count: 39
ICS Code (Semiconductor devices in general): 31.080.01
abstract:

Gives general rules to be used for the preparation of outline drawings of integrated circuits and indicates how to number integrated circuit case leads.

Document History

October 29, 1999
Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits
Gives guidance on the preparation of drawings of integrated circuits outlines.
Corrigendum 1 - Amendment 2 - Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits
A description is not available for this item.
November 16, 1995
Amendment 2 - Mechanical standardization of semiconductor devices. Part 3: General rules for the preparation of outline drawings of integrated circuits
A description is not available for this item.
January 1, 1983
Amendment 1 - Mechanical standardization of semiconductor devices. Part 3: General rules for the preparation of outline drawings of integrated circuits
A description is not available for this item.
IEC 60191-3:1974
January 1, 1974
Mechanical standardization of semiconductor devices. Part 3: General rules for the preparation of outline drawings of integrated circuits
Gives general rules to be used for the preparation of outline drawings of integrated circuits and indicates how to number integrated circuit case leads.
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