IEC - International Electrotechnical Commission - ISO/IEC 30129:2015+AMD1:2019 CSV
Information technology - Telecommunications bonding networks for buildings and other structures
published
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Organization: | IEC - International Electrotechnical Commission |
Publication Date: | 22 February 2019 |
Status: | published |
Page Count: | 99 |
ICS Code (Interface and interconnection equipment): | 35.200 |
abstract:
ISO/IEC 30129:2015+A1:2019 specifies requirements and recommendations for the design and installation of connections (bonds) between various electrically conductive elements in buildings and other... View More
Document History
ISO/IEC 30129:2015+AMD1:2019 CSV
February 22, 2019
Information technology - Telecommunications bonding networks for buildings and other structures
ISO/IEC 30129:2015+A1:2019 specifies requirements and recommendations for the design and installation of connections (bonds) between various electrically conductive elements in buildings and other...
February 22, 2019
Amendment 1 - Information technology - Telecommunications bonding networks for buildings and other structures
A description is not available for this item.
October 13, 2015
Information technology - Telecommunications bonding networks for buildings and other structures
ISO/IEC 30129:2015(E) specifies requirements and recommendations for the design and installation of connections (bonds) between various electrically conductive elements in buildings and other...