IEC - International Electrotechnical Commission - ISO/IEC 30129:2015+AMD1:2019 CSV

Information technology - Telecommunications bonding networks for buildings and other structures

published
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Organization: IEC - International Electrotechnical Commission
Publication Date: 22 February 2019
Status: published
Page Count: 99
ICS Code (Interface and interconnection equipment): 35.200
abstract:

ISO/IEC 30129:2015+A1:2019 specifies requirements and recommendations for the design and installation of connections (bonds) between various electrically conductive elements in buildings and other... View More

Document History

ISO/IEC 30129:2015+AMD1:2019 CSV
February 22, 2019
Information technology - Telecommunications bonding networks for buildings and other structures
ISO/IEC 30129:2015+A1:2019 specifies requirements and recommendations for the design and installation of connections (bonds) between various electrically conductive elements in buildings and other...
February 22, 2019
Amendment 1 - Information technology - Telecommunications bonding networks for buildings and other structures
A description is not available for this item.
October 13, 2015
Information technology - Telecommunications bonding networks for buildings and other structures
ISO/IEC 30129:2015(E) specifies requirements and recommendations for the design and installation of connections (bonds) between various electrically conductive elements in buildings and other...
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