IEC - International Electrotechnical Commission - IEC 60749-8:2002/COR1:2003
Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 8: Sealing
published
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| Organization: | IEC - International Electrotechnical Commission |
| Publication Date: | 23 April 2003 |
| Status: | published |
| ICS Code (Semiconductor devices in general): | 31.080.01 |
Document History
August 12, 2003
Corrigendum 2 - Semiconductor devices - Mechanical and climatic test methods - Part 8: Sealing
Modification of the validity date: now put at 2007.
IEC 60749-8:2002/COR1:2003
April 23, 2003
Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 8: Sealing
A description is not available for this item.
August 30, 2002
Semiconductor devices - Mechanical and climatic test methods - Part 8: Sealing
Applicable to semiconductor devices (discrete devices and integrated circuits), it determines the leak rate of semiconductor devices. The contents of the corrigenda of April 2003 and August 2003 have...