IEC - International Electrotechnical Commission - IEC 60749-8:2002/COR2:2003

Corrigendum 2 - Semiconductor devices - Mechanical and climatic test methods - Part 8: Sealing

published
Buy Now
Organization: IEC - International Electrotechnical Commission
Publication Date: 12 August 2003
Status: published
ICS Code (Semiconductor devices in general): 31.080.01
abstract:

Modification of the validity date: now put at 2007.

Document History

IEC 60749-8:2002/COR2:2003
August 12, 2003
Corrigendum 2 - Semiconductor devices - Mechanical and climatic test methods - Part 8: Sealing
Modification of the validity date: now put at 2007.
Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 8: Sealing
A description is not available for this item.
August 30, 2002
Semiconductor devices - Mechanical and climatic test methods - Part 8: Sealing
Applicable to semiconductor devices (discrete devices and integrated circuits), it determines the leak rate of semiconductor devices. The contents of the corrigenda of April 2003 and August 2003 have...
Advertisement