IEC - International Electrotechnical Commission - IEC 62047-10:2011/COR1:2012
Corrigendum 1 - Semiconductor devices - Micro-electromechanical devices - Part 10: Micro-pillar compression test for MEMS materials
published
Buy Now
| Organization: | IEC - International Electrotechnical Commission |
| Publication Date: | 28 February 2012 |
| Status: | published |
| ICS Code (Other semiconductor devices): | 31.080.99 |
Document History
IEC 62047-10:2011/COR1:2012
February 28, 2012
Corrigendum 1 - Semiconductor devices - Micro-electromechanical devices - Part 10: Micro-pillar compression test for MEMS materials
A description is not available for this item.
July 26, 2011
Semiconductor devices - Micro-electromechanical devices - Part 10: Micro-pillar compression test for MEMS materials
IEC 62047-10:2011 specifies micro-pillar compression test method to measure compressive properties of MEMS materials with high accuracy, repeatability, and moderate effort of specimen fabrication....