IEC - International Electrotechnical Commission - IEC 62047-10:2011
Semiconductor devices - Micro-electromechanical devices - Part 10: Micro-pillar compression test for MEMS materials
published
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| Organization: | IEC - International Electrotechnical Commission |
| Publication Date: | 26 July 2011 |
| Status: | published |
| Page Count: | 22 |
| ICS Code (Other semiconductor devices): | 31.080.99 |
abstract:
IEC 62047-10:2011 specifies micro-pillar compression test method to measure compressive properties of MEMS materials with high accuracy, repeatability, and moderate effort of specimen fabrication.... View More
Document History
February 28, 2012
Corrigendum 1 - Semiconductor devices - Micro-electromechanical devices - Part 10: Micro-pillar compression test for MEMS materials
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IEC 62047-10:2011
July 26, 2011
Semiconductor devices - Micro-electromechanical devices - Part 10: Micro-pillar compression test for MEMS materials
IEC 62047-10:2011 specifies micro-pillar compression test method to measure compressive properties of MEMS materials with high accuracy, repeatability, and moderate effort of specimen fabrication....