IEC - International Electrotechnical Commission - IEC 61191-1:2013
Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
revised
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| Organization: | IEC - International Electrotechnical Commission |
| Publication Date: | 21 May 2013 |
| Status: | revised |
| Page Count: | 96 |
| ICS Code (Electronic component assemblies): | 31.190 |
| ICS Code (Mechanical structures for electronic equipment): | 31.240 |
abstract:
IEC 61191-1:2013 prescribes requirements for materials, methods and verification criteria for producing quality soldered interconnections and assemblies using surface mount and related assembly... View More
Document History
September 14, 2018
Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
IEC 61191-1:2018 RLV contains both the official IEC International Standard and its Redline version. The Redline version is available in English only and provides you with a quick and easy way to...
September 14, 2018
Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
IEC 61191-1:2018 is also available as IEC 61191-1:2018 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous...
IEC 61191-1:2013
May 21, 2013
Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
IEC 61191-1:2013 prescribes requirements for materials, methods and verification criteria for producing quality soldered interconnections and assemblies using surface mount and related assembly...
August 28, 1998
Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
Prescribes requirements for materials, methods and verification criteria for producing quality soldered interconnections and assemblies using surface mounted and related assembly technologies. Also...