IEC - International Electrotechnical Commission - IEC 61191-1:2018 RLV

Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies

published
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Organization: IEC - International Electrotechnical Commission
Publication Date: 14 September 2018
Status: published
Page Count: 140
ICS Code (Electronic component assemblies): 31.190
ICS Code (Mechanical structures for electronic equipment): 31.240
abstract:

IEC 61191-1:2018 RLV contains both the official IEC International Standard and its Redline version. The Redline version is not an official document, it is available in English only and provides... View More

Document History

IEC 61191-1:2018 RLV
September 14, 2018
Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
IEC 61191-1:2018 RLV contains both the official IEC International Standard and its Redline version. The Redline version is not an official document, it is available in English only and provides you...
September 14, 2018
Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
IEC 61191-1:2018 is also available as IEC 61191-1:2018 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous...
May 21, 2013
Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
IEC 61191-1:2013 prescribes requirements for materials, methods and verification criteria for producing quality soldered interconnections and assemblies using surface mount and related assembly...
August 28, 1998
Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
Prescribes requirements for materials, methods and verification criteria for producing quality soldered interconnections and assemblies using surface mounted and related assembly technologies. Also...
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