IEC - International Electrotechnical Commission - IEC 60191-5:1997
Mechanical standardization of semiconductor devices - Part 5: Recommendations applying to integrated circuit packages using tape automated bonding (TAB)
published
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| Organization: | IEC - International Electrotechnical Commission |
| Publication Date: | 23 April 1997 |
| Status: | published |
| Page Count: | 71 |
| ICS Code (Semiconductor devices in general): | 31.080.01 |
abstract:
Gives recommendations applying to integrated circuits supplied in packages using tape automated bonding (TAB) as the principal component for structural and interconnection functions. Covers the... View More
Document History
IEC 60191-5:1997
April 23, 1997
Mechanical standardization of semiconductor devices - Part 5: Recommendations applying to integrated circuit packages using tape automated bonding (TAB)
Gives recommendations applying to integrated circuits supplied in packages using tape automated bonding (TAB) as the principal component for structural and interconnection functions. Covers the...
September 15, 1987
Mechanical standardization of semiconductor devices. Part 5: Recommendations applying to tape automated bonding (TAB) of integrated circuits.
Gives recommendations applying to tape automated bonding (TAB) of integrated circuits. Dimension values or requirements given in this standard for tape width, perforations, test pattern, outer lead...