IEC - International Electrotechnical Commission - IEC 60191-5:1987

Mechanical standardization of semiconductor devices. Part 5: Recommendations applying to tape automated bonding (TAB) of integrated circuits.

revised
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Organization: IEC - International Electrotechnical Commission
Publication Date: 15 September 1987
Status: revised
Page Count: 25
ICS Code (Semiconductor devices in general): 31.080.01
abstract:

Gives recommendations applying to tape automated bonding (TAB) of integrated circuits. Dimension values or requirements given in this standard for tape width, perforations, test pattern, outer... View More

Document History

April 23, 1997
Mechanical standardization of semiconductor devices - Part 5: Recommendations applying to integrated circuit packages using tape automated bonding (TAB)
Gives recommendations applying to integrated circuits supplied in packages using tape automated bonding (TAB) as the principal component for structural and interconnection functions. Covers the...
IEC 60191-5:1987
September 15, 1987
Mechanical standardization of semiconductor devices. Part 5: Recommendations applying to tape automated bonding (TAB) of integrated circuits.
Gives recommendations applying to tape automated bonding (TAB) of integrated circuits. Dimension values or requirements given in this standard for tape width, perforations, test pattern, outer lead...
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