IEC - International Electrotechnical Commission - IEC 60068-2-20:2008
Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
revised
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| Organization: | IEC - International Electrotechnical Commission |
| Publication Date: | 21 July 2008 |
| Status: | revised |
| Page Count: | 20 |
| ICS Code (Environmental testing): | 19.040 |
abstract:
IEC 60068-2-20:2008 outlines Test T, applicable to devices with leads. Soldering tests for surface mounting devices (SMD) are described in IEC 60068-2-58. This standard provides procedures for... View More
Document History
March 30, 2021
Environmental testing - Part 2-20: Tests - Test Ta and Tb: Test methods for solderability and resistance to soldering heat of devices with leads
IEC 60068-2-20:2021 is available as IEC 60068-2-20:2021 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous...
March 30, 2021
Environmental testing - Part 2-20: Tests - Test Ta and Tb: Test methods for solderability and resistance to soldering heat of devices with leads
IEC 60068-2-20:2021 RLV contains both the official IEC International Standard and its Redline version. The Redline version is available in English only and provides you with a quick and easy way to...
IEC 60068-2-20:2008
July 21, 2008
Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
IEC 60068-2-20:2008 outlines Test T, applicable to devices with leads. Soldering tests for surface mounting devices (SMD) are described in IEC 60068-2-58. This standard provides procedures for...
January 1, 1987
Amendment 2 - Basic environmental testing procedures - Part 2-20: Tests - Test T: Soldering
A description is not available for this item.
July 1, 1986
Amendment 1 - Basic environmental testing procedures - Part 2: Tests - Test T: Soldering
A description is not available for this item.
January 1, 1979
Environmental testing. Part 2: Tests. Test T: Soldering
Describes solderability tests on wire and tag terminations (Ta) and printed wiring boards (Tc), also describes tests for resistance to soldering heat, applicable to components (Tb).
January 1, 1968
Basic environmental testing procedures for electronic components and electronic equipment - Part 2: Tests - Test T: Soldering
A description is not available for this item.
January 1, 1960
Basic environmental testing procedures for electronic components and electronic equipment - Part 2: Tests - Test T: Soldering
A description is not available for this item.