IEC - International Electrotechnical Commission - IEC 60068-2-20:1979/AMD1:1986

Amendment 1 - Basic environmental testing procedures - Part 2: Tests - Test T: Soldering

revised
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Organization: IEC - International Electrotechnical Commission
Publication Date: 1 July 1986
Status: revised
Page Count: 3
ICS Code (Environmental testing): 19.040

Document History

July 21, 2008
Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
IEC 60068-2-20:2008 outlines Test T, applicable to devices with leads. Soldering tests for surface mounting devices (SMD) are described in IEC 60068-2-58. This standard provides procedures for...
Amendment 2 - Basic environmental testing procedures - Part 2-20: Tests - Test T: Soldering
A description is not available for this item.
IEC 60068-2-20:1979/AMD1:1986
July 1, 1986
Amendment 1 - Basic environmental testing procedures - Part 2: Tests - Test T: Soldering
A description is not available for this item.
January 1, 1979
Environmental testing. Part 2: Tests. Test T: Soldering
Describes solderability tests on wire and tag terminations (Ta) and printed wiring boards (Tc), also describes tests for resistance to soldering heat, applicable to components (Tb).
January 1, 1968
Basic environmental testing procedures for electronic components and electronic equipment - Part 2: Tests - Test T: Soldering
A description is not available for this item.
January 1, 1960
Basic environmental testing procedures for electronic components and electronic equipment - Part 2: Tests - Test T: Soldering
A description is not available for this item.
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