IEC - International Electrotechnical Commission - IEC 60917-1:1998
Modular order for the development of mechanical structures for electronic equipment practices - Part 1: Generic standard
revised
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| Organization: | IEC - International Electrotechnical Commission |
| Publication Date: | 17 September 1998 |
| Status: | revised |
| Page Count: | 39 |
| ICS Code (Mechanical structures for electronic equipment): | 31.240 |
abstract:
Gives the definitions of a modular order for mechanical structures of electronic equipment and provides for dimensional compatibility at mechanical interfaces with related engineering... View More
Document History
September 13, 2019
Modular order for the development of mechanical structures for electrical and electronic equipment practices - Part 1: Generic standard
IEC 60917-1:2019 is available as IEC 60917-1:2019 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition....
September 13, 2019
Modular order for the development of mechanical structures for electrical and electronic equipment practices - Part 1: Generic standard
IEC 60917-1:2019 RLV contains both the official IEC International Standard and its Redline version. The Redline version is available in English only and provides you with a quick and easy way to...
November 25, 2009
Modular order for the development of mechanical structures for electronic equipment practices - Part 1: Generic standard
IEC 60917-1:1998+A1:2000 Gives the definitions of a modular order for mechanical structures of electronic equipment and provides for dimensional compatibility at mechanical interfaces with related...
May 11, 2000
Amendment 1 - Modular order for the development of mechanical structures for electronic equipment practices - Part 1: Generic standard
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IEC 60917-1:1998
September 17, 1998
Modular order for the development of mechanical structures for electronic equipment practices - Part 1: Generic standard
Gives the definitions of a modular order for mechanical structures of electronic equipment and provides for dimensional compatibility at mechanical interfaces with related engineering applications.