IEC - International Electrotechnical Commission - IEC 60917-1:2019 RLV

Modular order for the development of mechanical structures for electrical and electronic equipment practices - Part 1: Generic standard

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Organization: IEC - International Electrotechnical Commission
Publication Date: 13 September 2019
Status: published
Page Count: 88
ICS Code (Mechanical structures for electronic equipment): 31.240
abstract:

IEC 60917-1:2019 RLV contains both the official IEC International Standard and its Redline version. The Redline version is not an official document, it is available in English only and provides... View More

Document History

September 13, 2019
Modular order for the development of mechanical structures for electrical and electronic equipment practices - Part 1: Generic standard
IEC 60917-1:2019 is available as IEC 60917-1:2019 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous...
IEC 60917-1:2019 RLV
September 13, 2019
Modular order for the development of mechanical structures for electrical and electronic equipment practices - Part 1: Generic standard
IEC 60917-1:2019 RLV contains both the official IEC International Standard and its Redline version. The Redline version is not an official document, it is available in English only and provides you...
November 25, 2009
Modular order for the development of mechanical structures for electronic equipment practices - Part 1: Generic standard
IEC 60917-1:1998+A1:2000 Gives the definitions of a modular order for mechanical structures of electronic equipment and provides for dimensional compatibility at mechanical interfaces with related...
Amendment 1 - Modular order for the development of mechanical structures for electronic equipment practices - Part 1: Generic standard
A description is not available for this item.
September 17, 1998
Modular order for the development of mechanical structures for electronic equipment practices - Part 1: Generic standard
Gives the definitions of a modular order for mechanical structures of electronic equipment and provides for dimensional compatibility at mechanical interfaces with related engineering applications.
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