IEC - International Electrotechnical Commission - IEC 60749-8:2002
Semiconductor devices - Mechanical and climatic test methods - Part 8: Sealing
published
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| Organization: | IEC - International Electrotechnical Commission |
| Publication Date: | 30 August 2002 |
| Status: | published |
| Page Count: | 31 |
| ICS Code (Semiconductor devices in general): | 31.080.01 |
abstract:
Applicable to semiconductor devices (discrete devices and integrated circuits), it determines the leak rate of semiconductor devices.
The contents of the corrigenda of April 2003 and August... View More
Document History
August 12, 2003
Corrigendum 2 - Semiconductor devices - Mechanical and climatic test methods - Part 8: Sealing
Modification of the validity date: now put at 2007.
April 23, 2003
Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 8: Sealing
A description is not available for this item.
IEC 60749-8:2002
August 30, 2002
Semiconductor devices - Mechanical and climatic test methods - Part 8: Sealing
Applicable to semiconductor devices (discrete devices and integrated circuits), it determines the leak rate of semiconductor devices. The contents of the corrigenda of April 2003 and August 2003 have...