IEC - International Electrotechnical Commission - IEC 61189-1:1997
Test methods for electrical materials, interconnection structures and assemblies - Part 1: General test methods and methodology
published
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| Organization: | IEC - International Electrotechnical Commission |
| Publication Date: | 27 March 1997 |
| Status: | published |
| Page Count: | 37 |
| ICS Code (Printed circuits and boards): | 31.180 |
abstract:
This series relates to test methods for printed boards and printed board assemblies, as well as related materials or component robustness, irrespective of their method of manufacture. This part... View More
Document History
November 22, 2001
Test methods for electrical materials, interconnection structures and assemblies - Part 1: General test methods and methodology
This series relates to test methods for printed boards and printed board assemblies, as well as related materials or component robustness, irrespective of their method of manufacture. This part...
August 9, 2001
Amendment 1 - Test methods for electrical materials, interconnection structures and assemblies - Part 1: General test methods and methodology
A description is not available for this item.
IEC 61189-1:1997
March 27, 1997
Test methods for electrical materials, interconnection structures and assemblies - Part 1: General test methods and methodology
This series relates to test methods for printed boards and printed board assemblies, as well as related materials or component robustness, irrespective of their method of manufacture. This part...