IEC - International Electrotechnical Commission - IEC 61189-1:1997/AMD1:2001

Amendment 1 - Test methods for electrical materials, interconnection structures and assemblies - Part 1: General test methods and methodology

published
Buy Now
Organization: IEC - International Electrotechnical Commission
Publication Date: 9 August 2001
Status: published
Page Count: 15
ICS Code (Printed circuits and boards): 31.180

Document History

November 22, 2001
Test methods for electrical materials, interconnection structures and assemblies - Part 1: General test methods and methodology
This series relates to test methods for printed boards and printed board assemblies, as well as related materials or component robustness, irrespective of their method of manufacture. This part...
IEC 61189-1:1997/AMD1:2001
August 9, 2001
Amendment 1 - Test methods for electrical materials, interconnection structures and assemblies - Part 1: General test methods and methodology
A description is not available for this item.
March 27, 1997
Test methods for electrical materials, interconnection structures and assemblies - Part 1: General test methods and methodology
This series relates to test methods for printed boards and printed board assemblies, as well as related materials or component robustness, irrespective of their method of manufacture. This part...
Advertisement