IEC - International Electrotechnical Commission - IEC 61191-3:1998
Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies
revised
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| Organization: | IEC - International Electrotechnical Commission |
| Publication Date: | 28 August 1998 |
| Status: | revised |
| Page Count: | 31 |
| ICS Code (Mechanical structures for electronic equipment): | 31.240 |
abstract:
Prescribes requirements for lead and hole solder assembly. The requirements pertain to those assemblies that are totally lead and hole, through-hole mounting technology (THT), or the THT portions... View More
Document History
May 30, 2017
Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies
IEC 61191-3:2017 prescribes requirements for lead and hole solder assemblies. The requirements pertain to those assemblies that totally use through-hole mounting technology (THT), or the THT portions...
IEC 61191-3:1998
August 28, 1998
Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies
Prescribes requirements for lead and hole solder assembly. The requirements pertain to those assemblies that are totally lead and hole, through-hole mounting technology (THT), or the THT portions of...