IEC - International Electrotechnical Commission - IEC 61191-3:2017

Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies

published
Buy Now
Organization: IEC - International Electrotechnical Commission
Publication Date: 30 May 2017
Status: published
Page Count: 20
ICS Code (Mechanical structures for electronic equipment): 31.240
abstract:

IEC 61191-3:2017 prescribes requirements for lead and hole solder assemblies. The requirements pertain to those assemblies that totally use through-hole mounting technology (THT), or the THT... View More

Document History

IEC 61191-3:2017
May 30, 2017
Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies
IEC 61191-3:2017 prescribes requirements for lead and hole solder assemblies. The requirements pertain to those assemblies that totally use through-hole mounting technology (THT), or the THT portions...
August 28, 1998
Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies
Prescribes requirements for lead and hole solder assembly. The requirements pertain to those assemblies that are totally lead and hole, through-hole mounting technology (THT), or the THT portions of...
Advertisement