IEC - International Electrotechnical Commission - IEC 60249-2-13:1987
Base materials for printed circuits. Part 2: Specifications. Specification No. 13: Flexible copper-clad polyimide film, general purpose grade
replaced
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| Organization: | IEC - International Electrotechnical Commission |
| Publication Date: | 30 September 1987 |
| Status: | replaced |
| Page Count: | 23 |
| ICS Code (Printed circuits and boards): | 31.180 |
abstract:
Gives requirements for properties of flexible copper-clad polyimide film, general purpose grade including optional requirements which apply only by agreement between purchaser and... View More
Document History
May 18, 1993
Amendment 1 - Base materials for printed circuits. Part 2: Specifications. Specification No. 13: Flexible copper-clad polyimide film, general purpose grade
A description is not available for this item.
IEC 60249-2-13:1987
September 30, 1987
Base materials for printed circuits. Part 2: Specifications. Specification No. 13: Flexible copper-clad polyimide film, general purpose grade
Gives requirements for properties of flexible copper-clad polyimide film, general purpose grade including optional requirements which apply only by agreement between purchaser and supplier. The...