IEC - International Electrotechnical Commission - IEC 60249-2-13:1987/AMD1:1993
Amendment 1 - Base materials for printed circuits. Part 2: Specifications. Specification No. 13: Flexible copper-clad polyimide film, general purpose grade
replaced
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| Organization: | IEC - International Electrotechnical Commission |
| Publication Date: | 18 May 1993 |
| Status: | replaced |
| Page Count: | 5 |
| ICS Code (Printed circuits and boards): | 31.180 |
Document History
IEC 60249-2-13:1987/AMD1:1993
May 18, 1993
Amendment 1 - Base materials for printed circuits. Part 2: Specifications. Specification No. 13: Flexible copper-clad polyimide film, general purpose grade
A description is not available for this item.
September 30, 1987
Base materials for printed circuits. Part 2: Specifications. Specification No. 13: Flexible copper-clad polyimide film, general purpose grade
Gives requirements for properties of flexible copper-clad polyimide film, general purpose grade including optional requirements which apply only by agreement between purchaser and supplier. The...