IEC - International Electrotechnical Commission - IEC TS 62647-4:2018
Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 4: Ball grid array (BGA) re-balling
published
Buy Now
| Organization: | IEC - International Electrotechnical Commission |
| Publication Date: | 10 April 2018 |
| Status: | published |
| Page Count: | 41 |
| ICS Code (Production. Production management): | 03.100.50 |
| ICS Code (Electronic components in general): | 31.020 |
| ICS Code (Aerospace electric equipment and systems): | 49.060 |
abstract:
IEC TS 62647-4:2018(E) defines the requirements for replacing solder balls on ball grid array (BGA) component packages in the context of an electronic components management plan (ECMP) for... View More
Document History
IEC TS 62647-4:2018
April 10, 2018
Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 4: Ball grid array (BGA) re-balling
IEC TS 62647-4:2018(E) defines the requirements for replacing solder balls on ball grid array (BGA) component packages in the context of an electronic components management plan (ECMP) for aerospace,...