ASTM International - ASTM F487-13(2018)

Standard Specification for Fine Aluminum–1 % Silicon Wire for Semiconductor Lead-Bonding

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Organization: ASTM International
Publication Date: 1 March 2018
Status: active
Page Count: 4
ICS Code (Wires): 29.060.10
scope:

1.1 This specification covers aluminum-1 % silicon alloy wire for internal connections in semiconductor devices and is limited to wire of diameter up to and including 76 μm (0.003 in.). For diameters larger than 76 μm (0.003 in.), the specifications are to be agreed upon between the purchaser and the supplier.

1.2 The values stated in SI units are to be regarded as the standard, regardless of whether they appear first or second in a table. Values given in parentheses are for information only.

1.3 This international standard was developed in accordance with internationally recognized principles on standardization established in the Decision on Principles for the Development of International Standards, Guides and Recommendations issued by the World Trade Organization Technical Barriers to Trade (TBT) Committee.

abstract:

This specification covers aluminum-1 % silicon alloy wire for semiconductor devices lead-bonding and is limited to wire of diameter up to and including 0.0020 in. (0.051 mm). The wire surface... View More

Document History

ASTM F487-13(2018)
March 1, 2018
Standard Specification for Fine Aluminum–1 % Silicon Wire for Semiconductor Lead-Bonding
1.1 This specification covers aluminum–1 % silicon alloy wire for internal connections in semiconductor devices and is limited to wire of diameter up to and including 76 μm (0.003 in.). For diameters...
January 1, 2013
Standard Specification for Fine Aluminum–1 % Silicon Wire for Semiconductor Lead-Bonding
1.1 This specification covers aluminum–1 % silicon alloy wire for internal connections in semiconductor devices and is limited to wire of diameter up to and including 76 μm (0.003 in.). For diameters...
January 1, 2006
Standard Specification for Fine Aluminum-1% Silicon Wire for Semiconductor Lead-Bonding
This specification covers aluminum-1 % silicon alloy wire for semiconductor devices lead-bonding and is limited to wire of diameter up to and including 0.0020 in. (0.051 mm). The wire surface shall...
January 1, 2001
Standard Specification for Fine Aluminum-1% Silicon Wire for Semiconductor Lead-Bonding
1.1 This specification covers aluminum-1% silicon alloy wire for internal connections in semiconductor devices and is limited to wire of diameter up to and including 0.0020 in. (0.051 mm). For...
January 1, 2001
Standard Specification for Fine Aluminum-1% Silicon Wire for Semiconductor Lead-Bonding
1.1 This specification covers aluminum-1% silicon alloy wire for internal connections in semiconductor devices and is limited to wire of diameter up to and including 0.0020 in. (0.051 mm). For...
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