IEC - International Electrotechnical Commission - IEC 60191-6-18:2010/COR2:2010
Corrigendum 2 - Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)
published
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| Organization: | IEC - International Electrotechnical Commission |
| Publication Date: | 28 July 2010 |
| Status: | published |
| Page Count: | 1 |
| ICS Code (Semiconductor devices in general): | 31.080.01 |
Document History
IEC 60191-6-18:2010/COR2:2010
July 28, 2010
Corrigendum 2 - Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)
A description is not available for this item.
May 31, 2010
Corrigendum 1 - Mechanical stardardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)
A description is not available for this item.
January 7, 2010
Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)
IEC 60191-6-18:2010 provides standard outline drawings, dimensions, and recommended variations for all square ball grid array packages (BGA), whose terminal pitch is 1 mm or larger. This standard...