IEC - International Electrotechnical Commission - IEC 60191-6-18:2010/COR2:2010

Corrigendum 2 - Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)

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Organization: IEC - International Electrotechnical Commission
Publication Date: 28 July 2010
Status: published
Page Count: 1
ICS Code (Semiconductor devices in general): 31.080.01

Document History

IEC 60191-6-18:2010/COR2:2010
July 28, 2010
Corrigendum 2 - Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)
A description is not available for this item.
Corrigendum 1 - Mechanical stardardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)
A description is not available for this item.
January 7, 2010
Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)
IEC 60191-6-18:2010 provides standard outline drawings, dimensions, and recommended variations for all square ball grid array packages (BGA), whose terminal pitch is 1 mm or larger. This standard...
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