IEC - International Electrotechnical Commission - IEC 62739-1:2013
Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 1: Erosion test method for metal materials without surface processing
published
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| Organization: | IEC - International Electrotechnical Commission |
| Publication Date: | 18 June 2013 |
| Status: | published |
| Page Count: | 36 |
| ICS Code (Electronic component assemblies): | 31.190 |
| ICS Code (Mechanical structures for electronic equipment): | 31.240 |
abstract:
IEC 62739-1:2013 provides an evaluating test method for the erosion of the metallic materials without surface processing intended to be used for lead-free wave soldering equipment as a solder bath... View More
Document History
IEC 62739-1:2013
June 18, 2013
Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 1: Erosion test method for metal materials without surface processing
IEC 62739-1:2013 provides an evaluating test method for the erosion of the metallic materials without surface processing intended to be used for lead-free wave soldering equipment as a solder bath...