IEC - International Electrotechnical Commission - IEC 62137-4:2014
Electronics assembly technology - Part 4: Endurance test methods for solder joint of area array type package surface mount devices
published
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| Organization: | IEC - International Electrotechnical Commission |
| Publication Date: | 9 October 2014 |
| Status: | published |
| Page Count: | 85 |
| ICS Code (Electronic component assemblies): | 31.190 |
abstract:
IEC 62137-4:2014 specifies the test method for the solder joints of area array type packages mounted on the printed wiring board to evaluate solder joint durability against thermo-mechanical... View More
Document History
IEC 62137-4:2014
October 9, 2014
Electronics assembly technology - Part 4: Endurance test methods for solder joint of area array type package surface mount devices
IEC 62137-4:2014 specifies the test method for the solder joints of area array type packages mounted on the printed wiring board to evaluate solder joint durability against thermo-mechanical stress....