IEC - International Electrotechnical Commission - IEC 62047-15:2015

Semiconductor devices - Micro-electromechanical devices - Part 15: Test method of bonding strength between PDMS and glass

withdrawn
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Organization: IEC - International Electrotechnical Commission
Publication Date: 5 March 2015
Status: withdrawn
Page Count: 21
ICS Code (Other semiconductor devices): 31.080.99
abstract:

IEC 62047-15:2015 describes test method for bonding strength between poly dimethyl siloxane (PDMS) and glass. Silicone-based rubber, PDMS, is used for building of chip-based microfluidic devices... View More

Document History

IEC 62047-15:2015
March 5, 2015
Semiconductor devices - Micro-electromechanical devices - Part 15: Test method of bonding strength between PDMS and glass
IEC 62047-15:2015 describes test method for bonding strength between poly dimethyl siloxane (PDMS) and glass. Silicone-based rubber, PDMS, is used for building of chip-based microfluidic devices...
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