IEC - International Electrotechnical Commission - IEC 62047-17:2015

Semiconductor devices - Micro-electromechanical devices - Part 17: Bulge test method for measuring mechanical properties of thin films

published
Buy Now
Organization: IEC - International Electrotechnical Commission
Publication Date: 5 March 2015
Status: published
Page Count: 54
ICS Code (Other semiconductor devices): 31.080.99
abstract:

IEC 62047-17:2015 specifies the method for performing bulge tests on the free-standing film that is bulged within a window. The specimen is fabricated with micro/nano structural film materials,... View More

Document History

IEC 62047-17:2015
March 5, 2015
Semiconductor devices - Micro-electromechanical devices - Part 17: Bulge test method for measuring mechanical properties of thin films
IEC 62047-17:2015 specifies the method for performing bulge tests on the free-standing film that is bulged within a window. The specimen is fabricated with micro/nano structural film materials,...
Advertisement