IEC - International Electrotechnical Commission - IEC 62047-17:2015
Semiconductor devices - Micro-electromechanical devices - Part 17: Bulge test method for measuring mechanical properties of thin films
published
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| Organization: | IEC - International Electrotechnical Commission |
| Publication Date: | 5 March 2015 |
| Status: | published |
| Page Count: | 54 |
| ICS Code (Other semiconductor devices): | 31.080.99 |
abstract:
IEC 62047-17:2015 specifies the method for performing bulge tests on the free-standing film that is bulged within a window. The specimen is fabricated with micro/nano structural film materials,... View More
Document History
IEC 62047-17:2015
March 5, 2015
Semiconductor devices - Micro-electromechanical devices - Part 17: Bulge test method for measuring mechanical properties of thin films
IEC 62047-17:2015 specifies the method for performing bulge tests on the free-standing film that is bulged within a window. The specimen is fabricated with micro/nano structural film materials,...