IEC - International Electrotechnical Commission - IEC 62047-26:2016
Semiconductor devices - Micro-electromechanical devices - Part 26: Description and measurement methods for micro trench and needle structures
published
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| Organization: | IEC - International Electrotechnical Commission |
| Publication Date: | 7 January 2016 |
| Status: | published |
| Page Count: | 57 |
| ICS Code (Other semiconductor devices): | 31.080.99 |
abstract:
IEC 62047-26:2016 specifies descriptions of trench structure and needle structure in a micrometer scale. In addition, it provides examples of measurement for the geometry of both structures. For... View More
Document History
IEC 62047-26:2016
January 7, 2016
Semiconductor devices - Micro-electromechanical devices - Part 26: Description and measurement methods for micro trench and needle structures
IEC 62047-26:2016 specifies descriptions of trench structure and needle structure in a micrometer scale. In addition, it provides examples of measurement for the geometry of both structures. For...