IEC - International Electrotechnical Commission - IEC 62047-27:2017

Semiconductor devices - Micro-electromechanical devices - Part 27: Bond strength test for glass frit bonded structures using micro-chevron-tests (MCT)

published
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Organization: IEC - International Electrotechnical Commission
Publication Date: 20 January 2017
Status: published
Page Count: 16
ICS Code (Other semiconductor devices): 31.080.99
abstract:

IEC 62047-27:2017(E) specifies a method for assessing the bond strength of glass frit bonded structures using micro-chevron-tests (MCT). It describes suitable sample geometry and provides guidance... View More

Document History

IEC 62047-27:2017
January 20, 2017
Semiconductor devices - Micro-electromechanical devices - Part 27: Bond strength test for glass frit bonded structures using micro-chevron-tests (MCT)
IEC 62047-27:2017(E) specifies a method for assessing the bond strength of glass frit bonded structures using micro-chevron-tests (MCT). It describes suitable sample geometry and provides guidance...
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