IEC - International Electrotechnical Commission - IEC 62047-27:2017
Semiconductor devices - Micro-electromechanical devices - Part 27: Bond strength test for glass frit bonded structures using micro-chevron-tests (MCT)
published
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| Organization: | IEC - International Electrotechnical Commission |
| Publication Date: | 20 January 2017 |
| Status: | published |
| Page Count: | 16 |
| ICS Code (Other semiconductor devices): | 31.080.99 |
abstract:
IEC 62047-27:2017(E) specifies a method for assessing the bond strength of glass frit bonded structures using micro-chevron-tests (MCT). It describes suitable sample geometry and provides guidance... View More
Document History
IEC 62047-27:2017
January 20, 2017
Semiconductor devices - Micro-electromechanical devices - Part 27: Bond strength test for glass frit bonded structures using micro-chevron-tests (MCT)
IEC 62047-27:2017(E) specifies a method for assessing the bond strength of glass frit bonded structures using micro-chevron-tests (MCT). It describes suitable sample geometry and provides guidance...