IEC - International Electrotechnical Commission - IEC 60749-37:2008
Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer
revised
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| Organization: | IEC - International Electrotechnical Commission |
| Publication Date: | 30 January 2008 |
| Status: | revised |
| Page Count: | 39 |
| ICS Code (Semiconductor devices in general): | 31.080.01 |
abstract:
Provides a test method that is intended to evaluate and compare drop performance of surface mount electronic components for handheld electronic product applications in an accelerated test... View More
Document History
October 12, 2022
Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer
IEC 60749-37:2022 RLV contains both the official IEC International Standard and its Redline version. The Redline version is available in English only and provides you with a quick and easy way to...
October 12, 2022
Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer
IEC 60749-37:2022 is available as IEC 60749-37:2022 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous...
IEC 60749-37:2008
January 30, 2008
Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer
Provides a test method that is intended to evaluate and compare drop performance of surface mount electronic components for handheld electronic product applications in an accelerated test...