IEC - International Electrotechnical Commission - IEC 62047-8:2011

Semiconductor devices - Micro-electromechanical devices - Part 8: Strip bending test method for tensile property measurement of thin films

published
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Organization: IEC - International Electrotechnical Commission
Publication Date: 14 March 2011
Status: published
Page Count: 36
ICS Code (Other semiconductor devices): 31.080.99
abstract:

IEC 62047-8:2011 specifies the strip bending test method to measure tensile properties of thin films with high accuracy, repeatability, moderate effort of alignment and handling compared to the... View More

Document History

IEC 62047-8:2011
March 14, 2011
Semiconductor devices - Micro-electromechanical devices - Part 8: Strip bending test method for tensile property measurement of thin films
IEC 62047-8:2011 specifies the strip bending test method to measure tensile properties of thin films with high accuracy, repeatability, moderate effort of alignment and handling compared to the...
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