IEC - International Electrotechnical Commission - IEC 60191-6-4:2003
Mechanical standardization of semiconductor devices - Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA)
published
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| Organization: | IEC - International Electrotechnical Commission |
| Publication Date: | 11 June 2003 |
| Status: | published |
| Page Count: | 16 |
| ICS Code (Semiconductor devices in general): | 31.080.01 |
abstract:
IEC 60191-6-4:2003 covers the requirements for the measuring methods of ball grid array (BGA) dimensions.
Document History
IEC 60191-6-4:2003
June 11, 2003
Mechanical standardization of semiconductor devices - Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA)
IEC 60191-6-4:2003 covers the requirements for the measuring methods of ball grid array (BGA) dimensions.