IEC - International Electrotechnical Commission - IEC 60749-16:2003
Semiconductor devices - Mechanical and climatic test methods - Part 16: Particle impact noise detection (PIND)
published
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| Organization: | IEC - International Electrotechnical Commission |
| Publication Date: | 17 January 2003 |
| Status: | published |
| Page Count: | 13 |
| ICS Code (Semiconductor devices in general): | 31.080.01 |
abstract:
Defines a test aiming at detecting the presence of loose particles inside a cavity device such as, for example, chips of ceramic, pieces of bonding wire or solder balls (prills).
Document History
IEC 60749-16:2003
January 17, 2003
Semiconductor devices - Mechanical and climatic test methods - Part 16: Particle impact noise detection (PIND)
Defines a test aiming at detecting the presence of loose particles inside a cavity device such as, for example, chips of ceramic, pieces of bonding wire or solder balls (prills).