IEC - International Electrotechnical Commission - IEC 62047-13:2012

Semiconductor devices - Micro-electromechanical devices - Part 13: Bend - and shear - type test methods of measuring adhesive strength for MEMS structures

published
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Organization: IEC - International Electrotechnical Commission
Publication Date: 28 February 2012
Status: published
Page Count: 30
ICS Code (Other semiconductor devices): 31.080.99
abstract:

IEC 62047-13:2012 specifies the adhesive testing method between micro-sized elements and a substrate using the columnar shape of the specimens. This international standard can be applied to... View More

Document History

IEC 62047-13:2012
February 28, 2012
Semiconductor devices - Micro-electromechanical devices - Part 13: Bend - and shear - type test methods of measuring adhesive strength for MEMS structures
IEC 62047-13:2012 specifies the adhesive testing method between micro-sized elements and a substrate using the columnar shape of the specimens. This international standard can be applied to adhesive...
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