IEC - International Electrotechnical Commission - IEC 60749-23:2004
Semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating life
published
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| Organization: | IEC - International Electrotechnical Commission |
| Publication Date: | 23 February 2004 |
| Status: | published |
| Page Count: | 17 |
| ICS Code (Semiconductor devices in general): | 31.080.01 |
abstract:
This test is used to determine the effects of bias conditions and temperature on solid state devices over time. It simulates the device operating condition in an accelerated way, and is primarily... View More
Document History
March 30, 2011
Semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating life
IEC 60749-23:2004+A1:2011 is used to determine the effects of bias conditions and temperature on solid state devices over time. It simulates the device operating condition in an accelerated way, and...
January 27, 2011
Amendment 1 - Semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating life
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IEC 60749-23:2004
February 23, 2004
Semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating life
This test is used to determine the effects of bias conditions and temperature on solid state devices over time. It simulates the device operating condition in an accelerated way, and is primarily...