IEC - International Electrotechnical Commission - IEC 60749-25:2003
Semiconductor devices - Mechanical and climatic test methods - Part 25: Temperature cycling
published
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| Organization: | IEC - International Electrotechnical Commission |
| Publication Date: | 11 July 2003 |
| Status: | published |
| Page Count: | 25 |
| ICS Code (Semiconductor devices in general): | 31.080.01 |
abstract:
Provides a test procedure for determining the ability of semiconductor devices and components and/or board assemblies to withstand mechanical stresses induced by alternating high and low... View More
Document History
IEC 60749-25:2003
July 11, 2003
Semiconductor devices - Mechanical and climatic test methods - Part 25: Temperature cycling
Provides a test procedure for determining the ability of semiconductor devices and components and/or board assemblies to withstand mechanical stresses induced by alternating high and low temperature...