IEC - International Electrotechnical Commission - IEC 60249-2-19:1992/AMD1:1993
Amendment 1 - Base materials for printed circuits - Part 2: Specifications - Specification No. 19: Thin bismaleimide/triazine modified epoxide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards
replaced
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| Organization: | IEC - International Electrotechnical Commission |
| Publication Date: | 18 May 1993 |
| Status: | replaced |
| Page Count: | 3 |
| ICS Code (Printed circuits and boards): | 31.180 |
Document History
May 19, 1994
Amendment 2 - Base materials for printed circuits - Part 2: Specifications - Specification No. 19: Thin bismaleimide/triazine modified epoxide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards
A description is not available for this item.
IEC 60249-2-19:1992/AMD1:1993
May 18, 1993
Amendment 1 - Base materials for printed circuits - Part 2: Specifications - Specification No. 19: Thin bismaleimide/triazine modified epoxide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards
A description is not available for this item.
March 31, 1992
Base materials for printed circuits - Part 2: Specifications - Specification No. 19: Thin bismaleimide/triazine modified epoxide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards
Gives requirements for properties of thin bismaleimide/triazine modified epoxide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer...