IEC - International Electrotechnical Commission - IEC 60317-5:1970
Specifications for particular types of winding wires - Part 5: Heat or solvent bonding enamelled round copper wire with high mechanical properties
revised
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| Organization: | IEC - International Electrotechnical Commission |
| Publication Date: | 1 January 1970 |
| Status: | revised |
| Page Count: | 23 |
Document History
IEC 60317-5:1970
July 28, 1970
Specifications for particular types of winding wires - Part 5: Heat or solvent bonding enamelled round copper wire with high mechanical properties
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